Newbie
Joined: 22/12/2023
Location: AustraliaPosts: 6
| Posted: 04:54am 03 Jun 2024 |
Hi OA47,
Did you use the same bed position for each of the solder resist removal attempts?
Just thinking it might be a small amount of play on the mill axis resulting in very slightly too much Z travel in that area of the bed, or maybe the bed is slightly higher in that area?
My thinking being Z axis zeroed OK so the tool tip height is the same, three different bits of copper clad board unlikely to warp in the same place and the G-CODE is correct for programmed Z height the only thing left that could vary is the actual machine...
I wonder if you could edit the G-CODE to re-zero Z before the route on the first of the problematic pads, that way you will know the tool is just touching the copper before the actual routing operation takes place. It would be a pain but it could indicate if there is some sort of back lash going on as prior to the zero the Z axis DRO will indicate the difference between the previous zero and the current one.
Another thing that might point at the problem is to run the clear off program after the isolation route without actually having the solder resist on or moving the board.
Hope this helps
SunBakedWA